High-Speed Design
High-Speed Design Made Simple
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Read ArticleConsiderations for Signal Plane Stackups
Signal plane stackups will determine trace impedance, power integrity, and signal integrity. You’ll need to design the right stackup for your digital or analog system.
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Read ArticleUnderstanding PCB Via-In-Pad Design
Via-in-pad design is one of the best solutions for routing high-density PCB designs. Here is more information on what VIPs are and how they can be used.
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Read ArticleRelating VSWR to Return Loss in PCB Design
The relationship of VSWR to return loss is consistent and calculable. Learn about the nature of this relationship and what applications utilize the equation in your electronics designs.
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Read ArticleManaging Interconnect Density and Signal Noise
Dense interconnects are susceptible to signal noise if not designed correctly. Here’s how Sigrity helps with managing interconnect density.
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Read ArticleWill Solder Mask Dielectric Constant Affect Circuit Performance?
Solder mask dielectric constant can affect circuit stability and performance, but under what conditions?
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Read ArticlePCB Via Placement in High-Speed Designs
Via placement in high-speed designs need careful consideration to ensure that the board performs as expected, and we have some ideas that can help you.
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Read ArticleDoes Noise Margin in a CMOS Inverter Affect Performance?
Noise margins in CMOS inverters is a standard of design margins to establish proper circuit functionality under specific conditions.
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Read Article
Colpitts Oscillator Circuits and Other Linear/Nonlinear Oscillator Functions
A Colpitts oscillator’s functionality permits its use as a VFO, such as in a superheterodyne receiver or even a spectrum analyzer, if utilizing a variable inductor.
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Read ArticleADSL Noise Margin Values and Effects of Other Characteristic Parameters on Functionality
The effect of noise margin parameters is critical to the functionality of ADSL connectivity.
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Read ArticleCommon Types of FEA Analysis for PCB Development
Knowing and applying the types of FEA analysis discussed in this blog will improve your design’s manufacturability and reliability.
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Read ArticleThermomechanical Analysis for Your Thermally Cycled PCB Designs
Thermomechanical Analysis for Your Thermally Cycled PCB Designs | Advanced PCB Design Blog | Cadence
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Read ArticleA PCB Designer's Guide to WiFi
WiFi printed circuit board technology from the beginning up to present day
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Read ArticleSolutions For Impossible PCB Designs
Learn how you can tackle high-speed and high-frequency PCB designs
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Read ArticleManaging Impedance in Your PDN
Your design data can be used in simulations to manage PDN impedance. Here’s how this works in PSpice from Cadence.
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Read ArticlePower Spectrum vs. Power Spectral Density: What Are You Measuring?
What’s the difference between power spectrum vs power spectral density? Here’s how these important concepts relate to your signals.
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Read ArticleHarmonic Termination in Amplifier Design
Analog signals can contain undesired harmonic components, but harmonic termination can be used to remove undesired frequency components.
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Read ArticleForward Bias vs. Reverse Bias and their Effects on Diode Functionality
Forward and reverse biasing gives a circuit designer optimal control over a diode's functionality.
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Read ArticlePeak Envelope Power and Your RF Signal Chain Simulations
You can optimize your signal chain to receive and transmit maximum peak envelope power with the right circuit simulator.
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Read ArticleWhat is a Pure(ly) Resistive Circuit and What are its Characteristics?
A purely resistive circuit is a circuit that has inductance so small that at its typical frequency, its reactance is insignificant.
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Read ArticleCreating a Stackup to Manage Power Planes
There are several keys to laying out a successful multilayer design. Here’s more information on one of those, a board layer stackup to manage power planes.
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