Manufacturing Improvement

Ensure Design Manufacturability

  • Solderability is More Than Selecting the Right Solder

    Solderability is More Than Selecting the Right Solder

    There are many factors that can affect PCB assembly, learn how you can mitigate some of the issues

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  • Why Do We Have To Follow Drawing Standards?

    Why Do We Have To Follow Drawing Standards?

    Creating documents that convey the design requirements is essential to communicate your goals.

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  • PCB Assembly Considerations

    PCB Assembly Considerations

    PCB assembly considerations include leveraging EDA software, adhering to DfA principles, and selecting quality components.

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  • Paper Circuit Boards: The Future of PCB Design

    Paper Circuit Boards: The Future of PCB Design

    This article discusses the different technologies that make paper printed circuit boards a viable option for future products.

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  • The Assembly House Blues: How to Head off a Common Assembly Issue

    The Assembly House Blues: How to Head off a Common Assembly Issue

    Here's some insight on the high stakes involved in the electronics assembly industry.

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  • PCB Material Properties You Should Consider During Board Design

    PCB Material Properties You Should Consider During Board Design

    Pay attention to these PCB material properties when designing your next board.

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  • Electronic Product Cost Estimation

    Electronic Product Cost Estimation

    Electronic product cost estimation recognizes that balance must exist between costs, risks, and benefits.

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  • Fused Filament Fabrication and Electronic 3D Printing

    Fused Filament Fabrication and Electronic 3D Printing

    Fused filament fabrication offers uniformity and operator control for 3D printing, greatly simplifying the process.

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  • The Benefits of Communicating with Your Fabrication, Assembly, and Manufacturing Engineer (CM)

    The Benefits of Communicating with Your Fabrication, Assembly, and Manufacturing Engineer (CM)

    Effectively communicating with your CM benefits a company throughout the design process, manufacturing process, and in-field use of their products.

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  • Understanding PCB Via-In-Pad Design

    Understanding PCB Via-In-Pad Design

    Via-in-pad design is one of the best solutions for routing high-density PCB designs. Here is more information on what VIPs are and how they can be used.

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  • Printed Circuit Board Design For Assembly: How to DFA

    Printed Circuit Board Design For Assembly: How to DFA

    DFA has become a complex issue as modern electronics continue to shrink while using greener processes.

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  • PCB Design Rules for Productivity and Profit

    PCB Design Rules for Productivity and Profit

    Modern electronics are far too complex to create without a strong set of rules to keep the design on track.

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  • Chemical Mechanical Polishing in VLSI and Other Semiconductor Technology

    Chemical Mechanical Polishing in VLSI and Other Semiconductor Technology

    Chemical mechanical polishing (CMP) in VLSI is a polishing process assisted by chemical reactions to remove surface materials.

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  • Implementing FMEA to Optimize PCBA Reliability

    Implementing FMEA to Optimize PCBA Reliability

    Failure mode and effects analysis (FMEA) is one of the best tools for optimizing PCBA reliability. Read this blog to see how to utilize it most effectively.

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  • Why Your CM’s PCB Design for Manufacturability Rules

    Why Your CM’s PCB Design for Manufacturability Rules

    When choosing the best PCB design for manufacturability rules you should look no further than your CM. Read this blog for why this is true.

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  • Why Solder Joint Inspection Is Important

    Why Solder Joint Inspection Is Important

    Solder joint inspection is a critical part of quality control, helping you detect joint problems as early as possible.

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  • Isotropic Etching to Anisotropic Etching and Semiconductor Manufacturing

    Isotropic Etching to Anisotropic Etching and Semiconductor Manufacturing

    Isotropic etching or wet etching is a process traditionally used in semiconductor manufacturing and silicon materials.

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  • Applying Failure Oriented Accelerated Testing (FOAT) to Your PCB DFR

    Applying Failure Oriented Accelerated Testing (FOAT) to Your PCB DFR

    Is physical testing for reliability really necessary? In this blog, we show how to use failure oriented accelerated testing (FOAT) and save unnecessary time and costs.

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  •  PCB Component Placement Accuracy Needs for Various Assembly Types

    PCB Component Placement Accuracy Needs for Various Assembly Types

    Designing for PCB component placement accuracy requires an understanding of the assembly processes used.

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  • Managing Component Keep Out Zones for Smart Layouts

    Managing Component Keep Out Zones for Smart Layouts

    Component keep out zones are important in your PCB layout to ensure that your layout doesn’t fail DRC or enclosure constraints.

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