Manufacturing Improvement

DFA has become a complex issue as modern electronics continue to shrink while using greener processes.

Modern electronics are far too complex to create without a strong set of rules to keep the design on track.

Chemical mechanical polishing (CMP) in VLSI is a polishing process assisted by chemical reactions to remove surface materials.

Failure mode and effects analysis (FMEA) is one of the best tools for optimizing PCBA reliability. Read this blog to see how to utilize it most effectively.

When choosing the best PCB design for manufacturability rules you should look no further than your CM. Read this blog for why this is true.

Solder joint inspection is a critical part of quality control, helping you detect joint problems as early as possible.

Isotropic etching or wet etching is a process traditionally used in semiconductor manufacturing and silicon materials.

Is physical testing for reliability really necessary? In this blog, we show how to use failure oriented accelerated testing (FOAT) and save unnecessary time and costs.

Designing for PCB component placement accuracy requires an understanding of the assembly processes used.

Component keep out zones are important in your PCB layout to ensure that your layout doesn’t fail DRC or enclosure constraints.

Ineffective process failure mode and effects analysis may do more harm than good. In this blog, we help you avoid this risk to your PCBA development.

IPC Web components are important to be able to procure for any designer working for speedy and accurate design production.

Shallow trench isolation thermal stress may be unavoidable; however, its effects can be mitigated as described in this blog.

Are you powerless to influence the manufacturing process flow for your boards? Far from it as we explain in this blog.

For the best results in printed circuit board assembly, here are some schematic considerations for assembly that can help your next PCB design.

Conducted susceptibility testing works through what might happen in a circuit if preset conditions for electrical noise are injected into the circuit.

When working through your DFM process for electronics hardware, you might consider looking into fused deposition modeling or FDM.

Knowing and applying the types of FEA analysis discussed in this blog will improve your design’s manufacturability and reliability.