Manufacturing Improvement

Ensure Design Manufacturability

  • Understanding PCB Via-In-Pad Design

    Understanding PCB Via-In-Pad Design

    Via-in-pad design is one of the best solutions for routing high-density PCB designs. Here is more information on what VIPs are and how they can be used.

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  • Printed Circuit Board Design For Assembly: How to DFA

    Printed Circuit Board Design For Assembly: How to DFA

    DFA has become a complex issue as modern electronics continue to shrink while using greener processes.

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  • PCB Design Rules for Productivity and Profit

    PCB Design Rules for Productivity and Profit

    Modern electronics are far too complex to create without a strong set of rules to keep the design on track.

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  • Chemical Mechanical Polishing in VLSI and Other Semiconductor Technology

    Chemical Mechanical Polishing in VLSI and Other Semiconductor Technology

    Chemical mechanical polishing (CMP) in VLSI is a polishing process assisted by chemical reactions to remove surface materials.

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  • Implementing FMEA to Optimize PCBA Reliability

    Implementing FMEA to Optimize PCBA Reliability

    Failure mode and effects analysis (FMEA) is one of the best tools for optimizing PCBA reliability. Read this blog to see how to utilize it most effectively.

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  • Why Your CM’s PCB Design for Manufacturability Rules

    Why Your CM’s PCB Design for Manufacturability Rules

    When choosing the best PCB design for manufacturability rules you should look no further than your CM. Read this blog for why this is true.

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  • Why Solder Joint Inspection Is Important

    Why Solder Joint Inspection Is Important

    Solder joint inspection is a critical part of quality control, helping you detect joint problems as early as possible.

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  • Isotropic Etching to Anisotropic Etching and Semiconductor Manufacturing

    Isotropic Etching to Anisotropic Etching and Semiconductor Manufacturing

    Isotropic etching or wet etching is a process traditionally used in semiconductor manufacturing and silicon materials.

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  • Applying Failure Oriented Accelerated Testing (FOAT) to Your PCB DFR

    Applying Failure Oriented Accelerated Testing (FOAT) to Your PCB DFR

    Is physical testing for reliability really necessary? In this blog, we show how to use failure oriented accelerated testing (FOAT) and save unnecessary time and costs.

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  •  PCB Component Placement Accuracy Needs for Various Assembly Types

    PCB Component Placement Accuracy Needs for Various Assembly Types

    Designing for PCB component placement accuracy requires an understanding of the assembly processes used.

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  • Managing Component Keep Out Zones for Smart Layouts

    Managing Component Keep Out Zones for Smart Layouts

    Component keep out zones are important in your PCB layout to ensure that your layout doesn’t fail DRC or enclosure constraints.

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  • Effective Process Failure Mode and Effects Analysis of PCBA Development

    Effective Process Failure Mode and Effects Analysis of PCBA Development

    Ineffective process failure mode and effects analysis may do more harm than good. In this blog, we help you avoid this risk to your PCBA development.

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  • IPC Web Component Downloads and Available Footprints

    IPC Web Component Downloads and Available Footprints

    IPC Web components are important to be able to procure for any designer working for speedy and accurate design production.

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  • Design Guidelines for Shallow Trench Isolation Thermal Stress Minimization

    Design Guidelines for Shallow Trench Isolation Thermal Stress Minimization

    Shallow trench isolation thermal stress may be unavoidable; however, its effects can be mitigated as described in this blog.

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  • PCBA Design for Optimal Manufacturing Process Flow

    PCBA Design for Optimal Manufacturing Process Flow

    Are you powerless to influence the manufacturing process flow for your boards? Far from it as we explain in this blog.

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  • PCB Design Schematic Considerations for Assembly

    PCB Design Schematic Considerations for Assembly

    For the best results in printed circuit board assembly, here are some schematic considerations for assembly that can help your next PCB design.

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  • Conducted Susceptibility Testing: Electronic Reliability in DFM Procedures

    Conducted Susceptibility Testing: Electronic Reliability in DFM Procedures

    Conducted susceptibility testing works through what might happen in a circuit if preset conditions for electrical noise are injected into the circuit.

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  • Fused Deposition Modeling Process: Heard of DFM, but Have You Heard of FDM?

    Fused Deposition Modeling Process: Heard of DFM, but Have You Heard of FDM?

    When working through your DFM process for electronics hardware, you might consider looking into fused deposition modeling or FDM.

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  • Common Types of FEA Analysis for PCB Development

    Common Types of FEA Analysis for PCB Development

    Knowing and applying the types of FEA analysis discussed in this blog will improve your design’s manufacturability and reliability.

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  • Who Owns the PCB?

    Who Owns the PCB?

    While you may design the PCB, you're not the owner. The owner is the end user.

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